Publication and dissemination List

Journal & Magazine

Y. Peng, S. Zhao, and H. Wang, “IoT-Aimed Health Monitoring Scheme for power semiconductor devices based on Mahalanobis processing,” IEEE Internet of Things Journal, vol. 11, no. 7, pp. 11246–11258, Nov. 2023, doi: 10.1109/jiot.2023.3330799.

X. Liao, S. Chen, P. Wen, and S. Zhao, “Remaining useful life with self-attention assisted physics-informed neural network,” Advanced Engineering Informatics, vol. 58, p. 102195, Oct. 2023, doi: 10.1016/j.aei.2023.102195.

P. Wen, Z.-S. Ye, Y. Li, S. Chen, P. Xie, and S. Zhao, “Physics-Informed neural networks for prognostics and health management of Lithium-Ion batteries,” IEEE Transactions on Intelligent Vehicles, vol. 9, no. 1, pp. 2276–2289, Sep. 2023, doi: 10.1109/tiv.2023.3315548.

X. Zhang, Y. Zhang, D. Zhou, X. Wu and H. Wang, “Computationally Efficient Dynamic Thermal Modeling Based on Dictionary Learning Reconstruction,” in IEEE Transactions on Power Electronics, vol. 38, no. 12, pp. 15152-15156, Dec. 2023, doi: 10.1109/TPEL.2023.3317249.

H. Wang et al., “A Junction Temperature Monitoring Method for IGBT Modules Based on Turn-Off Voltage With Convolutional Neural Networks,” in IEEE Transactions on Power Electronics, vol. 38, no. 8, pp. 10313-10328, Aug. 2023, doi: 10.1109/TPEL.2023.3278675.

Conferences

S. Sahoo and F. Blaabjerg, “Data-Driven Controllability of Power Electronics Under Boundary Conditions – A Physics-Informed Neural Network Based Approach,” 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), Orlando, FL, USA, 2023, pp. 2801-2806, doi: 10.1109/APEC43580.2023.10131654.

S. Zhao, J. Liu, K. Chu, S. Mu and H. Wang, “FPGA-based Degradation Evaluation for Traction Power Module with Deep Recurrent Autoencoder,” 2023 IEEE Energy Conversion Congress and Exposition (ECCE), Nashville, TN, USA, 2023, pp. 1542-1548, doi: 10.1109/ECCE53617.2023.10362793.

X. Zhang, Y. Zhang, D. Zhou, H. Wang and X. Wu, “Transient Thermal Modeling of Power Semiconductors for Long-Term Load Profiles,” 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), Orlando, FL, USA, 2023, pp. 2569-2574, doi: 10.1109/APEC43580.2023.10131438.

Y. Zhang, Y. Zhang, S. Zhao, B. Yao and H. Wang, “Physics-based Modeling of Packaging-related Degradation of IGBT Modules,” 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), Orlando, FL, USA, 2023, pp. 2463-2468, doi: 10.1109/APEC43580.2023.10131229.

Y. Zhang, Y. Zhang, B. Yao, S. Zhao and H. Wang, “Gradient-based End-of-life Criterion of Power Semiconductor Modules,” 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), Orlando, FL, USA, 2023, pp. 1167-1171, doi: 10.1109/APEC43580.2023.10131296.